Mei-Wei Cheng

Mei-Wei Cheng is the Non-Executive Chairman at HCP Packaging USA, a Senior Venture Partner at Fontinalis Partners, and a board director for NIU Technologies. Previously, he led nine companies, holding prominent executive positions such as President and Chief Executive Officer of Siemens China, Group Vice President at Ford Motor Company, and Vice President at General Electric. During his extensive tenure at these multinational corporations, he directed regional operations as Chairman and CEO of General Electric China and Chairman of Ford Motor China. He earned a bachelor's degree in industrial engineering from Cornell University and an MBA from Rutgers Business School, successfully accumulating an estimated net worth of $4,920,000 through his equity in firms like Lear Corporation. Today, Cheng primarily focuses on guiding global manufacturing, automotive, and technology enterprises through strategic board leadership and venture capital investments.