Eliyan is a technology company.
Eliyan is developing advanced chiplet interconnect technologies, including the NuLink™ die-to-die PHY, which supports high bandwidth and low latency for data centers.
Eliyan has raised $110.0M across 2 funding rounds.
Eliyan has raised $110.0M in total across 2 funding rounds.
Eliyan has raised $110.0M in total across 2 funding rounds.
Eliyan's investors include AMD, Arm Holdings, Coherent, Intel Capital, Meta, Samsung Catalyst Fund, Ehukai Investments.
Eliyan is a semiconductor company specializing in die-to-die (D2D) interconnect technology for chiplet-based systems, enabling super-large System-in-Packages (SiPs) with high bandwidth and power efficiency.[1][2][3] Its flagship product, NuLink, is a PHY technology supporting industry standards like Bunch of Wires (BoW) and Universal Chiplet Interface Express (UCIe), delivering up to 4x the bandwidth and 2x the power efficiency of alternatives, while serving AI data centers, high-bandwidth memory (HBM), and Gen AI subsystems by breaking memory and I/O bottlenecks.[2][3][4] Recently recognized in the EE Times Silicon 100 for 2025, Eliyan shows strong growth momentum through partnerships with Arm Total Design, Open Compute Project (OCP), and major foundries, alongside advancements like 64Gbps PHY in 3nm processes.[4]
Eliyan was founded in 2021 in Santa Clara, California, as a spin-out from Aquantia (acquired by Marvell in 2019), carrying over 6+ years of research and production on D2D technology.[1][2][5] CEO and Founder Ramin Farjadrad, a networking pioneer, developed the breakthrough interconnect architecture in 2016 while at Aquantia, leveraging cross-technology innovations for superior bandwidth, low latency, and efficiency.[2][3] This architecture gained traction with OCP adoption as BoW standard in 2022, evolving into UCIe support amid the chiplet shift beyond Moore's Law, with early patents (17 filed, focusing on computer memory and semiconductor fabrication) marking pivotal validation.[1][2]
Eliyan rides the chiplet revolution, transitioning from monolithic dies to modular chiplets for AI-driven data centers, where interconnects are critical amid slowing Moore's Law and surging Gen AI demands.[2][4] Timing aligns with 2022 UCIe standardization and OCP expansions (e.g., Oct 2025 announcements), fueled by market forces like HBM shortages and need for open ecosystems over proprietary stacks.[1][4][5] By enabling massive SiPs and memory pooling, Eliyan influences the ecosystem toward a "general marketplace" for chiplets, accelerating AI performance while cutting costs—positioning it as a key enabler alongside Arm and foundries.[2][4]
Eliyan is poised to dominate chiplet interconnects as AI sub-systems scale, with NuLink-X expansions targeting C2C and memory innovations showcased at OCP Global Summit 2025.[4] Trends like open chiplet economies (UCIe/OCP growth) and 3nm+ processes will amplify its edge, potentially capturing share in data center TCO savings amid HBM evolution.[1][2][4] Influence may evolve through deeper Arm/OCP integrations and Dutch ecosystem entry, solidifying its role in the "ultimate chiplet interconnect" for next-gen AI—building directly on its high-bandwidth origins to power the post-Moore era.[3][4][5]
Eliyan has raised $110.0M across 2 funding rounds. Most recently, it raised $50.0M Venture Round in January 2026.
| Date | Round | Lead Investors | Other Investors |
|---|---|---|---|
| Jan 28, 2026 | $50.0M Venture Round | AMD, Arm Holdings, Coherent, Intel Capital, Meta, Samsung Catalyst Fund | |
| Mar 1, 2024 | $60.0M Series B | Ehukai Investments, Intel Capital |