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§ Private Profile · Changshan, Hunan, China
OSAT provider offering advanced integrated circuit packaging and testing services, including SiP and flip-chip.
Based in Changsha, China, Anmuquan Intelligent Technology develops advanced integrated circuit packaging solutions, testing services, and proprietary process software for the global semiconductor industry. The enterprise specializes in system in package, flip chip, and 3D packaging technologies to facilitate the independent manufacturing of critical hardware components like CPUs, GPUs, DSPs, and SSDs. Operating a primary manufacturing facility covering five thousand square meters, the firm provides outsourced semiconductor assembly and test services directly to fabless chip design companies. To expand its advanced packaging capabilities and internal research operations, the organization has raised over 54 million dollars from prominent institutional and corporate investors including SMIC, Shenzhen Capital Group, and China Fortune Tech Capital. Zhu Wenhui originally founded the company in 2017 to address domestic supply chain gaps by accelerating the construction of an advanced chip packaging base.
Anmuquan Intelligent Technology has raised $54.6M across 1 funding round.
Anmuquan Intelligent Technology has raised $54.6M in total across 1 funding round.
Anmuquan Intelligent Technology has raised $54.6M across 1 funding round. Most recently, it raised $54.6M Series C in October 2023.
| Date | Round | Lead Investors | Other Investors | Status |
|---|---|---|---|---|
| Oct 20, 2023 | $54.6M Series C | — | Changjian Investment | Announced |
Anmuquan Intelligent Technology has raised $54.6M in total across 1 funding round.
Anmuquan Intelligent Technology's investors include Changjian Investment.