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§ Private Profile · Austin, TX, USA
Provides two-phase direct-to-chip liquid cooling systems for data centers, HPC, and AI infrastructure, handling extreme heat loads.
Based in Austin, Texas, Accelsius develops advanced two-phase direct-to-chip liquid cooling systems for enterprise data centers, high-performance computing environments, and artificial intelligence infrastructure. The company's NeuCool platform utilizes water-free, non-conductive dielectric refrigerants originally developed by Nokia Bell Labs to manage extreme heat loads reaching up to 4500 watts per socket. This specialized hardware enables colocation facilities and edge computing operators to support high-density workloads while reducing overall facility energy costs by up to 50 percent. Operating from a newly opened manufacturing hub, Accelsius maintains a workforce of approximately 25 employees and has secured roughly $89 million in total venture funding. This capitalization includes a $65 million Series B financing round backed by strategic corporate investors Johnson Controls and Legrand. The hardware company was officially founded in 2022 by the venture creation firm Innventure.
Accelsius has raised $89.0M across 2 funding rounds.
Accelsius has raised $89.0M in total across 2 funding rounds.
Accelsius has raised $89.0M in total across 2 funding rounds.
Accelsius's investors include Austin Domenici, Brian DiBella, Bill Haskell.
Accelsius has raised $89.0M across 2 funding rounds. Most recently, it raised $65.0M Series B in January 2026.
| Date | Round | Lead Investors | Other Investors | Status |
|---|---|---|---|---|
| Jan 12, 2026 | $65M Series B | Austin Domenici | Brian Dibella | Announced |
| Nov 13, 2024 | $24M Series A | Bill Haskell | — | Announced |